Chip Module Encapsulation Machine PTCME302
  • Chip Module Encapsulation Machine PTCME302
  • Chip Module Encapsulation Machine PTCME302
  • Chip Module Encapsulation Machine PTCME302
  • Chip Module Encapsulation Machine PTCME302
Chip Module Encapsulation Machine PTCME302

Presentation: The new generation of high-speed smart card chip module dosing, UV curing, encapsulated module thickness measurement and visual inspection system.

Advantage: Easy Operation, Durable 7x24 Concepts, Mature Tech

Application: Smart Card Chip Module Encapsulation

Brochure Download:Down

  • Overview
  • Typical Client Needs
  • Photo & Video
  • Features
  • Specification
  • Why Buy It
  • Reference & Feedback
  • Service & Support
  • FAQ
  • Question & Advice
Overview
PTCME302 represents the new generation of high-speed smart card chip module dosing, UV curing, encapsulated module thickness measurement and visual inspection system. 100% online control of the whole process can minimize manual intervention and save labor costs. Latest dosing program for dosing head with 16 dosing nozzles which makes the dosing quality higher and maintaining easier, realizes a simpler operation. The LED UV lamp of PTCME302 curing module is significantly smaller than traditional UV gas discharge lamps, while it has a higher power to makes the production more efficiency. PTCME302 configured encapsulated module thickness measurement module as well as upper and lower chip module surface defect inspection module to saving factory labor cost and control product quality effectively.
 
Advantages
· Real-time monitoring of dosing effect and encapsulation thickness.
· Visual dosing trajectory design can easily create a dosing path.
· Encapsulated module thickness accuracy ±30um.
· DAM resin and Filling resin or Double Filling resin production mode.
· Automatic X/Y direction movement punching hole function.
· Detailed production process report.
· Optional visual defect inspection function.
 
Configurations
· Unwinding/Rewinding module
1. A tray with an inner diameter of φ40mm (without keyway) and an outer diameter of φ500mm can be loaded.
2. A protective tape tray with an inner diameter of φ40mm (without keyway) and an outer diameter of φ500mm can be loaded.
 
· Tape Driving Module
1. Tape tensioning, forward transmission and backward rewinding functions.
2. Servo driver + pin wheel mechanism for tape transmission.
3. Tape running accuracy is no more than ±0.1mm.
 
· Unwinding Detection Module
1. Bad holes and side holes from unwiding tapes can be detected.
2. X/Y sliding table is installed at the bottom of the mechanism to facilitate precise adjustment of the sensor position.
 
· Dosing Module
1. 2 sets of dosing heads (suitable for 9.5mm tapes) with 16 dosing nozzles for each are configured.
2. 14.25mm dosing head with 16 dosing nozzles for each is optional.
3. Applicable resin types include: DAM resin and Filling resin.
4. The dosing head is driven by the X/Y/Z three-axis motion mechanism with accuracy is no more than ±0.1mm, and the encapsulated module thickness accuracy is no more than ±0.03mm.
5. Zero correction for Z-axis dosing nozzle can re-calibrate the height of Z-axis after replacing the dosing head.
 
· Optional Positioning Module
1. A set of visual positioning system is installed behind each dosing module.
2. Module tape positioning function and dosing absence detection function are configured.
3. Linkage control between visual positioning system and the three-axis motion mechanism of the dosing module to ensure that the position accuracy after dosing is no more than ±0.1mm.
4. Camera with 5 million pixel is configured.
 
· UV Curing Module
1. 1.2m LED UV lampis equipped.
2. The LED UV lamp can be automatically raised and lowered by software control. When the UV lamp is attenuated, the height of the lamp can be adjusted to compensate for the curing effect.
3. The LED UV lamp can be moved back into the maintenance position as a whole, and can be turned back 90° to facilitate the maintenance or replacement of the LED UV lamp.
 
· Thickness Measurement Module
1. 8 length gauges in total are configured.
2. Adjustment function in X, Y and Z three directions.
 
· Punching Module
1. A hole will be punched on the chip that is failed in thickness measurement and dosing appearance defect inspection.
2. Following punching mode, the diameter of the punching hole is 2±0.1mm, and the position error is no more than 0.2mm.
 
· Software
1. Control system software.
2. Dosing trajectory graphic design software.
3. Visual recognition and positioning software.
4. Visual monitoring software.
5. Dosing appearance defect inspection software. (optional)
 
· Filling Resin Supply System
1 set of Filling Resin Supply System is configured.
 
· DAM Resin Supply System
1 set of DAM Resin Supply System is configured.
 
· Optical Surface Defect Inspection Module (optional):
1. Appearance size and defect inspection on the encapsulated block after UV curing can be realized.
2. Defects such as unencapsulated, missing solder joints, repeated dosing, dosing deviation, sinking, dragging, large or small dosing size, wrinkles and other defects can be inspected.
3. 3 sets of 5 million pixel cameras are configured.

Throughput


SPECIFICATIONS

Dimension

 •   7300mm×1200mm×2000mm(LxWxH)

Weight

 •   2100kg

Power Supply

 •   220V (-5%~+10%), 50Hz, 8KW

Noise

 •   < 65 dB

Operation Temperature

 •   23℃±3℃

Operation Humidity

 •   50±10%rh

Compressed Air

 •   Pressure: 0.6MPa Flow:1500LPM

Maximum Throughput

 •   Glob Top:33000UPH Damm & Fill:23000UPH


Advantages
· Real-time monitoring of dosing effect and encapsulation thickness.
· Visual dosing trajectory design can easily create a dosing path.
· Encapsulated module thickness accuracy ±30um.
· DAM resin and Filling resin or Double Filling resin production mode.
· Automatic X/Y direction movement punching hole function.
· Detailed production process report.
· Optional visual defect inspection function.
SPECIFICATIONS

Dimension

 •   7300mm×1200mm×2000mm(LxWxH)

Weight

 •   2100kg

Power Supply

 •   220V (-5%~+10%), 50Hz, 8KW

Noise

 •   < 65 dB

Operation Temperature

 •   23℃±3℃

Operation Humidity

 •   50±10%rh

Compressed Air

 •   Pressure: 0.6MPa Flow:1500LPM

Maximum Throughput

 •   Glob Top:33000UPH Damm & Fill:23000UPH


               


  

                               


        

Services before Sales

  • Reply your inquiry within 24 hours.
  • Communication by email.
  • Welcome you visiting our factory and final users in China.
  • Help for VISA application and Invitation Letter issuing.
  • We afford you consultation for 24 hours of 7 days in the process of sale and after service by phone or mail. We will support you for advisory opinion in purchasing, explanation in various technical problems and reliable supply in technique support.


Services on Purchasing

  • Communication by email.
  • Welcome you visiting our factory and final users in China.
  • Help for VISA application and Invitation Letter issuing.

 

Services after Sales

  • Online Support, 24 hours feedback once got the email
  • Enough Spare Parts Preparation for you…
  • Engineer to customer’s site for training & repairment
  • Our equipments have 12 months for quality guarantee after sale. If the equipments do not work because of self cause, we will do free service and change the damaged spare parts.
  • We will do life-long maintenance for all of our sold equipments. After quality guarantee period, if you can not maintain the equipments by self, we are under an obligation to go to work place and assist you to make maintenance. The cost of spare parts as well as expenses of traveling and man-hour of worker will be negotiated separately. Spare parts will be supported whether during guarantee period or not.
  • After have finished maintenance, our service engineer will do training for the operators in plenty of time so that operators can be ensured to independently make operation, debugging and daily plant maintenance.
Question & Advice

Thank you for supporting RSID Solutions. Pls kindly let us know, if you have any question & suggestion.

Q: Would you please leave your Company Name & Contact Info? (mandatory)
Q: Are you using our products? What’s the model?
Q: What do you think about the quality of our products?
Q: Are you satisfied with the function? What other functions do you need?
Q: Do you like our Service? What else can we do for you?
Q: Do you have any other question or advice? You’ll get our reply in 24 hours.
Q: Would you please leave your Company Name & Contact Info? (mandatory)
Q: Are you Card Manufacturer or Card Issuer?
Q: What type of card do you produce? What’s your main biz?
Q: What type of equipment are you looking for?
Q: Does your current production capacity not satisfy the PO or company plan? What is your expected production capacity?
Q: Do you wish to replace your old equipment? What are the machines model you are currently using?
Q: Do you wish to add a new production line? Which kind of it do you prefer? Contact card or contactless card? Prelam-inlay or banking card EMV migration?
Q: Are you looking for a new technology for tender? What’s your requirement?
Q: Are you looking for personalization machines?what type of chip are you using?What are your printing requirements, monochrome or CMYK? Do you have any other requirements such as hot stamping or embossing?
Q: Are you looking for quick shipment service?
Q: Are you looking for affordable machine?
Q: Please tell us your exact cards requirement, if our machine can’t meet your needs.
Q: Would you please leave your Company Name & Contact Info? (mandatory)
Q: Are you looking for a reliable machine for card manufacturer, issuer like Banking, Telecom Operator, or any other card business player?
Q: Are you looking for a reliable professional supplier who is concerned about your needs?
Q: Are you looking for a professional supplier who can provide 1 year warranty and thoughtful after-sale service?
Q: Are you looking for a win-win opportunity to make a difference?
Q: Do you wish to be our foreign agent? What’s your advantages?
Q: Do you have any other question or advice? You’ll get your reply in 24 hours.
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